The following table provides a list of DSCC approved test methods implemented at Solitron.
Discretion of Test Method | Test Method Number |
MIL-PRF-19500 Test Methods per MIL-STD-750 |
MIL-PRF-38534 Test Methods per MIL-STD-883 |
Barometric Pressure | 1001 | X | |
Insulation Resistance | 1003 | X | |
Moisture Resistance | 1004 | X | |
Steady State Life Test | 1005 | X | |
High Temperature Stabilization Bake | 1008 | X | |
Salt Atmosphere | 1009 | X | |
Temperature Cycling | 1010 | X | |
Thermal Shock (Liquid to Liquid) | 1011 | X | |
Fine & Gross Leak Seal | 1014 | X | |
Burn-In | 1015 | X | |
Insulation Resistance | 1016 | X | |
Moisture Resistance | 1021 | X | |
Resistance to Solvents (Marking Permanence) | 1022 | X | |
Steady State Life Test | 1026 | X | |
Steady State Life Test | 1027 | X | |
High Temperature Life | 1031 | X | |
High Temperature Stabilization Bake | 1032 | X | |
Intermittent Operational Life | 1036 | X | |
Intermittent Operational Life | 1037 | X | |
High Temperature Reverse Bias | 1039 | X | |
Salt Atmosphere | 1041 | X | |
Temperature Cycling | 1051 | X | |
Thermal Shock (Liquid to Liquid) | 1056 | X | |
Fine & Gross Leak Seal | 1071 | X | |
Constant Acceleration | 2001 | X | |
Mechanical Shock | 2002 | X | |
Solderability | 2003 | X | |
Lead Integrity (Terminals Strength) | 2004 | X | |
Constant Acceleration | 2006 | X | |
Variable Frequency Vibration | 2007 | X | |
External Visual | 2009 | X | |
Internal Visual (monolithic) | 2010 | X | |
Bond Strength | 2011 | X | |
Internal Visual Mechanical | 2014 | X | |
Resistance to Solvents (Marking Permanence) | 2015 | X | |
Physical Dimensions | 2016 | X | X |
Internal Visual (Hybrid) | 2017 | X | |
Die Shear (Die Attach Integrity) | 2019 | X | |
Particle Impact Noise Detection (PIND) | 2020 | X | |
Non-Destruct Bond Pull | 2023 | X | |
Solderability | 2026 | X | |
Soldering Heat | 2031 | X | |
Internal Visual (Passive) | 2032 | X | |
Stud Torque | 2036 | X | |
Non-Destruct Bond Pull | 2037 | X | |
Particle Impact Noise Detection (PIND) | 2052 | X | |
Variable Frequency Vibration | 2056 | X | |
Physical Dimensions | 2066 | X | |
External Visual | 2071 | X | |
Internal Visual (Transistors) | 2072 | X | X |
Internal Visual (Diodes) | 2073 | X | |
Internal Visual Mechanical | 2075 | X | |
Radiography | 2076 | X | |
Break Down Voltage, Collector to Base | 3001 | X | |
Break Down Voltage, Collector to Emitter | 3011 | X | |
Breakdown Voltage, Emitter to Base | 3026 | X | |
Collector to Base Cutoff Current | 3036 | X | |
Collector to Emitter, Cutoff Current | 3041 | X | |
Safe Operating Area (Continues DC) | 3051 | X | |
Safe Operating Area (Switching) | 3053 | X | |
Emitter to Base, Cutoff Current | 3061 | X | |
Base Emitter Voltage (Saturated or Non-saturated) | 3066 | X | |
Saturation Voltage and Resistance | 3071 | X | |
Forward Current Transfer Ratio | 3076 | X | |
Thermal Impedance | 3131 | X | |
Thermal Resistance | 3151 | X | |
Small Signal Short-Circuit Forward-Current Transfer Ratio | 3206 | X | |
Open Circuit Output Capacitance | 3236 | X | |
Input Capacitance (Output Open-Circuited or Short Circuited) | 3240 | X | |
Noise Figure | 3246 | X | |
Pulse Response | 3251 | X | |
Extrapolated Unity Gain Frequency | 3261 | X | |
Real Part of Small-Signal Short-Circuit Input Impedance | 3266 | X | |
Small Signal Short-Circuit Forward-Current Transfer Ratio | 3306 | X | |
Breakdown Voltage, Drain to Source | 3401 | X | |
Gate to Source Voltage or Current | 3403 | X | |
Drain to Source On-State Voltage | 3405 | X | |
Gate Reverse Current | 3411 | 3412 | X | |
Drain Current | 3413 | X | |
Small-Signal Drain to Source On-State Resistance | 3423 | X | |
Small-Signal, Common-Source, Short Circuit, Input Capacitance | 3431 | X | |
Small-Signal, Common-Source, Short Circuit, Reverse Transfer Capacitance | 3433 | X | |
Small-Signal, Common-Source, Short Circuit, Output Admittance | 3453 | X | |
Small-Signal, Common-Source, Short Circuit, Forward Transmittance | 3455 | X | |
Small-Signal, Common-Source, Short Circuit, Reverse Transfer Admittance | 3459 | X |